MANUFACTURING METHOD OF PLATING FILM AND PLATING TREATMENT DEVICE
- 申请公布号：
- JP2008001966(A)
- 申请号：
- JP20060175135
- 申请日期：
- 2006.06.26
- 申请公布日期：
- 2008.01.10
- 申请人：
- SEIKO EPSON CORP
- 发明人：
- HASHI YUKIHIRO
- 分类号：
- C23C18/31;C23C18/44;H05K3/18
- 主分类号：
- C23C18/31
- 摘要：
- PROBLEM TO BE SOLVED: To provide a manufacturing method of a plating film, which reduces an influence of oxygen supply on the flow of a plating solution and yields a highly reliable plating film, and a plating treatment device. SOLUTION: At least a pair of electrodes 20a and 20b is placed in the plating solution 5, and a substrate P is immersed in the plating solution 5. By applying a voltage to the pair of electrodes 20a and 20b, oxygen is generated in the plating solution 5 through electrolysis of water contained in the plating solution 5, and the plating film is formed on the substrate P. COPYRIGHT: (C)2008,JPO&INPIT
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