PRINTING METHOD OF PHOTOPOLYMERIZABLE RESIN FILM FORMED ON SUBSTRATE FOR PRINTED WIRING BOARD
- 申请公布号：
- JPS59146056(A)
- 申请号：
- JP19830020353
- 申请日期：
- 1983.02.09
- 申请公布日期：
- 1984.08.21
- 申请人：
- HITACHI KASEI KOGYO KK
- 发明人：
- YOSHIDA SUMIO;SHIMADA MASAHIRO;KIMURA YUKIHIRO;SEKIGUCHI HIROSHI;NAKAMURA TOSHIO;KAIDOU MASANORI
- 分类号：
- G03C5/08;G03F7/20;H05K3/00
- 主分类号：
- G03C5/08
- 摘要：
- PURPOSE:To eliminate the deviation in a process film and to improve the dimensional accuracy of printed circuits by placing a transparent plate provided with air discharging grooves between the process film superposed on a photopolymerizable resin film and a transparent flexible film. CONSTITUTION:A process film 2 is superposed on a substrate 1 for a printed circuit board formed with a photopolymerizable resin film and a transparent plate 3 provided with air discharging grooves 11 on the surface that contacts with the film 2 is further placed thereon. The assembly thereof is sandwiched with a transparent support plate 5 of a printing machine and a transparent flexible film 4 and are subjected to exposure and printing in a vacuum state. The movement of the film 2 that arises in the stage of the vacuum state is thus suppressed by the plate 3 and air is removed through the grooves 11 provided to the plate 3, by whic the tight contact condition between the film 2 and the substrate 1 formed with the photopolymerizable resin film is made thorough and the dimensional accuracy of the printed circuit is improved.
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