RESIN PRODUCT MANUFACTURING METHOD AND RESIN MOLDING PLATE
- 申请公布号：
- JP2003053781(A)
- 申请号：
- JP20010244150
- 申请日期：
- 2001.08.10
- 申请公布日期：
- 2003.02.26
- 申请人：
- CASIO COMPUT CO LTD
- 发明人：
- MINAMI SHUNJI;SAKURAZAWA NAOHIKO;SONODA HIROYUKI
- 分类号：
- B29C45/26;B29C45/17;B29C51/26;B29L31/00;B29L31/34;(IPC1-7):B29C45/17
- 主分类号：
- B29C45/26
- 摘要：
- PROBLEM TO BE SOLVED: To provide a resin product manufacturing method using a resin molding plate capable of enhancing productivity. SOLUTION: The resin molding plate 1 having a plurality of product parts 10 is molded from a resin and predetermined treatment such as hard coat treatment, printing or the like is applied to the product parts 10 and the product parts 10 are separated from the resin molding plate 1 to obtain individual products (Fig 1). Outer edge projected parts 12 projected from the surfaces of the product parts 10 are provided, and the surfaces of the product parts 10 are turned downwardly to prevent the generation of a damage or the like caused by the contact with the product parts 10 when the resin molding plate 1 is arranged (Fig 1). Further, stepped parts are processed to the product parts 10 at the same time by a stepped bite 9 in a cutting separation process [Fig 8 (d)]. Further, a resin molding plate 5 having the product parts 10 and connection parts 25 and 26 is molded and two or more resin molding plates 5 are connected by the connection parts 25 and 26 to apply predetermined treatment (Fig 11).
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