HEATER TIP FOR THERMOCOMPESSION BONDING

申请公布号:
WO03097288(A1)
申请号:
WO2003JP04597
申请日期:
2003.04.11
申请公布日期:
2003.11.27
申请人:
KOBO PDA CO., LTD.;ISHII, TATSUYA
发明人:
ISHII, TATSUYA
分类号:
B23K3/03;B23K3/04;B23K3/047;(IPC1-7):B23K3/047
主分类号:
B23K3/03
摘要:
A heater tip for thermocompression bonding capable of eliminating the possibilities of separation of the thermo-detecting part of a thermocouple and breakage of leads by heating and vibration, wherein a set of power terminal parts, a heat-pressure welded part (2) heated by an energization resistance, and a part for a thermocouple for temperature control are provided in a small plate piece (1) manufactured by forging a tungsten alloy, a cutout part (5) for inserting the connected end part of the thermocouple (6) is recess-formed near the heat-pressure welded part (2) starting from the edge part of the small plate piece, and the thermo-detecting part (7) formed by thermally fusing the connected end part is fitted to the small plate piece so as to cover the side end face of the small plate piece and the mouth edge part of the cut-in part.
专利推荐
移动版 | 电脑版 | 返回顶部