ELECTROLESS GOLD PLATING LIQUID AND ELECTROLESS GOLD PLATING METHOD
- 申请公布号：
- JP2007308796(A)
- 申请号：
- JP20070109773
- 申请日期：
- 2007.04.18
- 申请公布日期：
- 2007.11.29
- 申请人：
- HITACHI CHEM CO LTD
- 发明人：
- TAKAHASHI AKIO;YAMAMOTO HIROSHI;HASEGAWA KIYOSHI
- 分类号：
- C23C18/44
- 主分类号：
- C23C18/44
- 摘要：
- PROBLEM TO BE SOLVED: To provide an electroless gold plating liquid which is particularly excellent in stability, exhibits a sufficient precipitation speed even at a low temperature and yields a coating film having a good appearance. SOLUTION: The electroless gold plating liquid comprises a gold salt, a reducing agent represented by formula (1) (wherein R<SP>1</SP>is a hydroxyl group or an amino group; and R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each independently a hydroxyl group, an amino group, a hydrogen atom or an alkyl group), a heavy metal salt and a polyethylene glycol compound. COPYRIGHT: (C)2008,JPO&INPIT
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