MICROWAVE HEATING APPARATUS

申请公布号:
US2014291318(A1)
申请号:
US201414219981
申请日期:
2014.03.19
申请公布日期:
2014.10.02
申请人:
Tokyo Electron Limited
发明人:
SHIMOMURA Kouji;KITAGAWA Junichi;YAMAMOTO Nobuhiko;HAYASHI Hiroyuki;TANAKA Sumi
分类号:
H05B6/64
主分类号:
H05B6/64
地址:
Tokyo JP
摘要:
A microwave heating apparatus is provided to perform heat treatment on a substrate to be processed by irradiating a microwave to the substrate in a processing chamber. The microwave heating apparatus includes a supporting table configured to support the substrate in the processing chamber, a microwave introducing unit configured to introduce the microwave into the processing chamber, a coolant channel formed in the supporting table, and a coolant supply source configured to supply a coolant to the coolant channel. At least a surface of the supporting table which supports the substrate is made of a material in which a product of a relative dielectric constant and a dielectric loss angle is smaller than 0.005, and the coolant supplied from the coolant supply source is liquid having no electrical polarity.
主权项:
1. A microwave heating apparatus for performing heat treatment on a substrate to be processed by irradiating a microwave to the substrate in a processing chamber, comprising: a supporting table configured to support the substrate in the processing chamber; a microwave introducing unit configured to introduce the microwave into the processing chamber; a coolant channel formed in the supporting table; and a coolant supply source configured to supply a coolant to the coolant channel, wherein at least a surface of the supporting table which supports the substrate is made of a material in which a product of a relative dielectric constant and a dielectric loss angle is smaller than 0.005; and wherein the coolant supplied from the coolant supply source is liquid having no electrical polarity.
专利推荐
移动版 | 电脑版 | 返回顶部