基板と電子部品の接続構造

申请公布号：

JP5733159(B2)

申请号：

JP20110241268

申请日期：

2011.11.02

申请公布日期：

2015.06.10

分类号：

H05K1/18;H01R12/71

主分类号：

H05K1/18

摘要：

<p><P>PROBLEM TO BE SOLVED: To provide a connection structure of a substrate and an electronic component in which contact resistance is reduced by suppressing contact slide. <P>SOLUTION: A connection structure electrically connects a printed connecting terminal (1') of a printed circuit board (1) and a connecting terminal (2') of an electronic component (2). The connection structure comprises a first pat (4) which is soldered to the printed connecting terminal (1') of the printed circuit board (1), a second pat (3) which is soldered to the connecting terminal (2') of the electronic component (2), a conductive spring (7) including contacts which are connected electrically to the first pat (4) and the second pat (3), respectively, and a partition wall (5) of an insulation material which positions the conductive spring (7). In the connection structure, connection planes of the first pat (4) and the second pat (3) to the contacts are covered with a metal having excellent conductivity. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>