BURIAL STRUCTURE FOR FEEDING CONDUCTOR

申请公布号：

JP2016063684(A)

申请号：

JP20140191178

申请日期：

2014.09.19

申请公布日期：

2016.04.25

申请人：

TAISEI CORP;TOYOHASHI UNIV OF TECHNOLOGY

发明人：

ENDO TETSUO;FUJIOKA TOMOMI;JINNAI HIROSHI;OSAWA KAZUYA;OHIRA TAKASHI;SAKAI NAOTAKA;SUZUKI YOSHITERU;TORII TOSHIHIRO

分类号：

H02J50/00;E01B25/28

主分类号：

H02J50/00

摘要：

PROBLEM TO BE SOLVED: To provide a burial structure for a feeding conductor capable of preventing feeding efficiency from being reduced.SOLUTION: The burial structure includes: a substrate-side member 13 that is formed from an insulative material; a first conductor 14 and a second conductor 15 which are disposed in parallel at left and right sides while interposing a predetermined interval therebetween; and a surface member formed from a material of which the field loss is reduced. The first conductor 14 and the second conductor 15 are buried over any one of or both the substrate-side member 13 and a surface member 16 and surrounded by the substrate-side member 13 or the surface member 16. Therefore, efficiency reduction with current leak is suppressed and wireless feeding can be performed with high efficiency.SELECTED DRAWING: Figure 1