Copper foil for printed circuit

申请公布号：

US9580829(B2)

申请号：

US201113635147

申请日期：

2011.02.03

申请公布日期：

2017.02.28

申请人：

JX Nippon Mining & Metals Corporation

发明人：

Arai Hideta;Miki Atsushi

分类号：

B21C37/00;C25D7/06;C25D5/12;H05K3/38;C25D1/04;C25D3/38;C25D3/56;C25D3/58;C25D9/04

主分类号：

B21C37/00

代理机构：

Howson & Howson, LLP

代理人：

Howson & Howson, LLP

地址：

Tokyo JP

摘要：

Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

主权项：

1. A copper foil for printed circuits prepared by forming a roughening primary particle layer of copper on a surface of a copper foil, and then forming a roughening secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the roughening primary particle layer; wherein the surface is to be bonded to a resin base layer, the average particle size of the roughening primary particle layer is 0.25 to 0.45 μm, the average particle size of the roughening secondary particle layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm, and 10 to 30 mg/dm2 of copper, 100 to 3000 μg/dm2 of cobalt, and 50 to 500 μg/dm2 of nickel are deposited in the roughening secondary particle layer based on the ternary alloy.