ADHESIVE APPLICATION APPARATUS AND CONTROL METHOD OF THE SAME
- 申请公布号：
- JP2012166151(A)
- 申请号：
- JP20110029498
- 申请日期：
- 2011.02.15
- 申请公布日期：
- 2012.09.06
- 申请人：
- SEIKO EPSON CORP
- 发明人：
- HOSHINO MASARU
- 分类号：
- B05C11/10;B05C5/00;B05D1/26;B05D3/00;B05D7/24;B42C9/00
- 主分类号：
- B05C11/10
- 摘要：
- <P>PROBLEM TO BE SOLVED: To suppress an adhesive application amount while ensuring an appropriate adhesive force when adhesion surfaces of media are pasted to each other. <P>SOLUTION: A paste formation pattern for odd numbers on which dot groups are arranged in an island form and a paste formation pattern for even numbers A on which dot groups are arranged at opposing positions to the dot groups on the paste formation pattern for odd numbers in an island form are set. Further, a paste discharge head is controlled such that the set paste formation pattern for odd numbers is formed on an adhesion surface of an odd-numbered sheet of paper and the discharge head is controlled such that the set paste formation pattern for even numbers is formed on an adhesion surface of an even-numbered sheet of paper. Therefore, an adhesive application amount can be suppressed in comparison with a case where the adhesive is uniformly applied to the entire of both the adhesion surfaces. Moreover, application regions formed on both the adhesion surfaces can be overlapped with one another, so that the adhesive application amount can be also suppressed while ensuring an appropriate adhesive force. <P>COPYRIGHT: (C)2012,JPO&INPIT
Copyright Notice © 2009-2024 传众 版权所有