Gerät zum Polieren von Wafers
- 申请公布号:
- DE69504549(D1)
- 申请号:
- DE1995604549
- 申请日期:
- 1995.02.10
- 申请公布日期:
- 1998.10.15
- 申请人:
- SHIN-ETSU HANDOTAI CO., LTD., TOKIO/TOKYO, JP
- 发明人:
- TOMINAGA, HIROYOSHI, HARANAKA-SHATAKU 208, NISHI-SHIRAKAWA-GUN, FUKUSHIMA-KEN, JP;SUZUKI, YOSHINORI, RYOKUHU-RYO, NISHI-SHRAKAWA-GUN, FUKUSHIMA-KEN, JP
- 分类号:
- B24B37/00;B24B37/04;B24B37/30;B24B53/017;H01L21/304;(IPC1-7):B24B37/04
- 主分类号:
- B24B37/00
- 摘要:
- The present invention provides an apparatus for polishing wafers, wherein high work efficiency in handling a polishing plate is achieved with high flatness finish of the polished wafers. The apparatus has a polishing plate 1 composed of two plates 2, 3, which are superimposed in tight adhesion with each other. The thickness of the polishing plate 1 is adjusted to such a value that the polished wafers may be finished with high flatness across the polished surface. An upper plate 2 is mounted to a top ring 4 by means of a a plurality of rigid supporting member 7 consisting of a hook-shaped plate holding portion 7a and a top ring fixing portion 7b such that a predetermined clearance is left between the upper surface of the upper plate 2 and a flexible thin plate 5 arranged on the lower portion of the top ring 4. The upper and lower plates 2, 3 are polished to be flat and smooth across one side surface to be superimposed of each thereof and then the upper plate 2 and lower plate 3 are superimposed with each other in tight adhesion by surface tension of a liquid. <IMAGE>
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