VERFAHREN ZUM HERSTELLEN VON ELEKTRISCHEN LEITERPLATTEN UND BASISMATERIAL FUER SOLCHE
- 申请公布号：
- DE2739494(A1)
- 申请号：
- DE19772739494
- 申请日期：
- 1977.08.30
- 申请公布日期：
- 1979.03.08
- 申请人：
- FUBA,HANS KOLBE & CO
- 发明人：
- PASSLICK,THEODOR
- 分类号：
- B32B15/04;B32B5/00;B32B15/08;H05K1/03;H05K1/05;H05K3/42;H05K3/44;(IPC1-7):01B5/14
- 主分类号：
- B32B15/04
- 摘要：
- Molded laminates useful in the preparation of electrically conductive panels are provided by a method comprising providing an article comprising a metal carrier or support layer, at least one insulating layer and a copper outer layer, the carrier having a plurality of perforations therethrough which are substantially filled with the insulating material, and compressing the layered article to produce a molded laminate. In other embodiments, the method comprises the further steps of forming a hole through at least some of the filled perforations, and, if desired, sensitizing the walls of the holes to electroless metal deposition and depositing a layer of metal thereon. Articles produced by the methods of this invention are also provided.
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