SEMICONDUCTOR DEVICE

申请公布号：

JPH0722547(A)

申请号：

JP19930159717

申请日期：

1993.06.29

申请公布日期：

1995.01.24

申请人：

KAWASAKI STEEL CORP

发明人：

KUGISHIMA MASAHIRO

分类号：

H01L23/34;F16L9/18;H01L23/36;H01L23/40;H01L23/433

主分类号：

H01L23/34

摘要：

PURPOSE:To release heat effectively from a metal heat sink by providing a pad exposed from the upper surface of a semiconductor chip and a metal heat sink which is arranged on the upper surface of the pad in direct contact with the pad. CONSTITUTION:A semiconductor chip 1 and a lead frame 5 are electrically connected with a wire 7 and a metal heat sink 11 is formed on a film carrier 9. This metal heat sink 11 is integrated with a semiconductor chip 1 through bump coupling for realizing direct contact with the pad 3. The integrated semiconductor chip 1 and film carrier 9 are assembled with a package of resin, etc. Thereby, malfunction can be prevented by effective heat radiation from the metal heat sink 11.