ELECTRONIC PARTS MOUNTING APPARATUS

申请公布号：

JPH08181491(A)

申请号：

JP19940325817

申请日期：

1994.12.27

申请公布日期：

1996.07.12

申请人：

TOSHIBA CORP

发明人：

TSUCHIDA MASANORI

分类号：

B23P21/00;H05K13/04

主分类号：

B23P21/00

摘要：

PURPOSE: To determine whether or not electronic parts having a small lead pitch can be mounted on a substrate by measuring the height of each lead of the parts, using a laser displacement sensor. CONSTITUTION: An electronic parts mounting apparatus is constituted as follows. The height of each lead 1aa of lead rows of a QFP type IC 1 is measured, using a laser displacement sensor 9. From the measured data an approximate straight line or fantastic plane of the lead row 1a at each side is obtained by a judging circuit to obtain a floating quantity of each lead 1aa, using this line or plane as a criterion, thereby judging whether or not the IC 1 can be mounted on a printed circuit board.