CERAMIC MULTILAYER BOARD

申请公布号：

JPH08181445(A)

申请号：

JP19940320503

申请日期：

1994.12.22

申请公布日期：

1996.07.12

申请人：

SUMITOMO METAL IND LTD

发明人：

YAMADE YOSHIAKI;MORIYA YOICHI

分类号：

H01L21/60;H01L23/12;H05K3/46

主分类号：

H01L21/60

摘要：

PURPOSE: To remove noise and to simply and effectively mount a semiconductor element having high integration by forming bump electrodes on the surface mounted with the element and the surface opposed thereto. CONSTITUTION: When an LSI chip 11 is placed as a semiconductor element on a ceramic multilayer board 20, the chip 11 is disposed at a predetermined position on the board 20, then it is heated at a predetermined temperature and then the predetermined terminal of an integrated circuit of the chip 11 is connected fixed to the bump electrode 24 formed on the upper surface 21a of the board placed with the LSI 11. When a the board 20 placed with the chip 11 is mounted on a printed circuit board 14, the board 20 is disposed at a predetermined position on the board 14, it is heated at a predetermined temperature. Then, a bump electrode 26 formed on the opposed lower surface 21b of the board is connected fixedly to the predetermined terminal of the wiring pattern on the board 14.