WIRE BONDING METHOD

申请公布号：

JPH09326423(A)

申请号：

JP19960144433

申请日期：

1996.06.06

申请公布日期：

1997.12.16

申请人：

DENSO CORP

发明人：

WATANABE TAKESHI

分类号：

H01L21/60;H01L21/607

主分类号：

H01L21/60

摘要：

PROBLEM TO BE SOLVED: To improve bonding between a wire and a pad by eliminating a contamination layer and an oxide film therebetween reliably and in a stable manner. SOLUTION: Wire bonding is performed through at least a first process and a second process where different loads and ultrasonic-wave vibrations are provided between a wire 4 and a pad 6 in a state where the wire 4 is abutted against the pad 6. More specifically, prior to the second process where the wire 4 is ultrasonic-wave bonded to the pad 6, a load less than that in the second process and a ultrasonic-wave vibration greater than that in the second process are provided to the wire 4 and the pad 6, as the first process. Thus, the soft wire 4 intensely rubs the surface of the pad 6 only at a region necessary for wire bonding. This preferably eliminates a contaminated layer of the surfaces of both members and even an oxide film, thus naturally improves the bonding.