System for measuring surface flatness using shadow moir+E,acu e+EE technology
- 申请公布号：
- US5835223(A)
- 申请号：
- US19960778214
- 申请日期：
- 1996.12.30
- 申请公布日期：
- 1998.11.10
- 申请人：
- ELECTRONIC PACKAGING SERVICES, LTD.
- 发明人：
- ZWEMER, DIRK A.;HASSELL, PATRICK B.
- 分类号：
- G01B11/30;(IPC1-7):G01B11/30;G01B11/00;G01N21/00
- 主分类号：
- G01B11/30
- 摘要：
- A system for measuring surface characteristics of an electronic interconnection component, such as a printed circuit board, by analyzing shadow moir+E,acu e+EE patterns. Printed circuit boards are carried on a continuous conveyor under a grating. For each printed circuit board, a shadow moir+E,acu e+EE fringe pattern is created in response to a determination that the printed circuit board is properly located under a grating and within the field of view of a camera. Fringes of the shadow moir+E,acu e+EE fringe pattern are quantified over one or a multiple of analysis paths to determining if the printed circuit board is unacceptably warped, in which case a signal is generated. For each printed circuit board, multiple images can be captured and mathematically combined, by image subtraction, to produce an enhanced shadow moir+E,acu e+EE fringe pattern that is analyzed for warpage.
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