WATERPROOF LAYER AND CONSTRUCTION METHOD THEREFOR

申请公布号:
JP2000038776(A)
申请号:
JP19980207877
申请日期:
1998.07.23
申请公布日期:
2000.02.08
申请人:
TAISEI CORP;DYFLEX CORP
发明人:
SASAKI HARUO;SUZUKI TOSHIYUKI
分类号:
E04B1/66;B32B13/12;(IPC1-7):E04B1/66
主分类号:
E04B1/66
摘要:
PROBLEM TO BE SOLVED: To prevent generation of a pinhole without being influenced by a crack of backing concrete by arranging a conductive insulating layer on the surface of a concrete structure, and spraying a super speed-curing resin on the outside. SOLUTION: A conductive insulating layer 2 is installed on the surface of a concrete structure 1 such as a heat accumulating tank through a metallic material, and a super speed-curing resin layer 3 is sprayed on or the applied to the outside. A heat insulating layer is installed on the surface of concrete, and a super speed-curing resin may be sprayed on the outside where the conductive insulating layer is installed through an adhesive. The conductive insulating layer 2 is formed of a film-like body such as woven fabric, nonwoven fabric and a net-like body by performing conductive work or a film and foil by performing conductive working. At inspection time, the conductive insulating layer 2 is earthed, and an electrode is approached from the outside of the super speed-curing resin layer 3, or an eddy current type film thickness meter is approached to measure a position of a pinhole and film pressure. Thus, a reliable waterproof layer can be formed without deteriorating executability even in a narrow place.
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