Kartenpackung gemäss PCMCIA-Standard

申请公布号：

DE69424324(T2)

申请号：

DE1994624324T

申请日期：

1994.07.13

申请公布日期：

2000.09.14

申请人：

FARQUHAR, JIM;CENTOFANTE, CHARLIE;DORF, KEN;WEIBEZAHN, BRANDT;FAJARDO, IGGONI

发明人：

FARQUHAR, JIM;CENTOFANTE, CHARLIE;DORF, KEN;WEIBEZAHN, BRANDT;FAJARDO, IGGONI

分类号：

H05K5/00;B29C45/14;B29C45/40;B29C65/08;G06K19/07;G06K19/077;H05K5/02;H05K7/14;(IPC1-7):B29C65/02;H05K5/04;H05K5/03

主分类号：

H05K5/00

摘要：

A method for manufacturing a package 10 for a memory card 28. The method includes the steps of mating plastic frames around a PCB containing semiconductor devices, encapsulating frames and PCB within two stamped metal outer covers, that are then bonded together by a form of welding or by using an adhesive. The plastic frame elements 16, 18 are introduced in the method by an injection molding process. <IMAGE>