FLEXIBLE LAMINATE FOR FLEXIBLE CIRCUIT
- 申请公布号:
- WO2000054969(A1)
- 申请号:
- US1999030487
- 申请日期:
- 1999.12.20
- 申请公布日期:
- 2000.09.21
- 摘要:
- <p>Method of forming a flexible circuit laminate (70) for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper (24) on a first side of a generally continuous strip of polyimide (22) having a layer of metal (23) on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a performed adhesive film (44) on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.</p>
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