ELECTROSTATIC CHUCK OF HIGH THERMAL CONDUCTIVITY, USABLE IN VACUUM, AND EASY TO DEFORM
- 申请公布号：
- JP2000260856(A)
- 申请号：
- JP20000066473
- 申请日期：
- 2000.03.10
- 申请公布日期：
- 2000.09.22
- 申请人：
- NIKON CORP
- 发明人：
- MICHAEL SOGAADO
- 分类号：
- G03F7/20;H01L21/683;H02N13/00;(IPC1-7):H01L21/68
- 主分类号：
- G03F7/20
- 摘要：
- <p>PROBLEM TO BE SOLVED: To allow use in vacuum while, comprising high thermal conductivity, not affected by dust particles, by fitting a membrane to a support member with a frame and beam, forming a hollow region, and connecting the hollow region to a cooling gas supply source through a gas piping hole. SOLUTION: A membrane 108 of an electrostatic chuck comprises a beam 104 and a frame 102, and the membrane 108 is combined to an upper part layer 112 of a support member 110 with the beam 104 and the frame 102. A hollow region 107 is formed between an upper part layer 112 and the membrane 108. A gas piping hole 106 penetrates a part of the support member 110. The upper layer part 112 is made of a wafer while, with the wafer being thin, a bottom surface is finely worked to provide a small groove 114. The groove 114 raises efficiency for transferring a heat to a cooling liquid which fills the hollow part 116 of the support member 110. Thus, use in vacuum is allowed while immune to the effect of dust particles and deformation of a holding member, suppressing temperature rise with the holding member.</p>
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