Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components

申请公布号：: US6125026(A)
申请号：: US19990343908
申请日期：: 1999.06.30
申请公布日期：: 2000.09.26
申请人：: U.S. PHILIPS CORPORATION
发明人：: DE SAMBER, MARK A.;VAN DE WALLE, GERJAN F. A.
分类号：: H05K1/18;H01G4/30;H01L23/498;H05K3/30;H05K3/34;H05K7/02;(IPC1-7):H01G4/30
主分类号：: H05K1/18
摘要：: The invention relates to an electric component (surface mountable component) which can be mounted on the surface of a printed circuit board. Such a component includes a thin, electroconductive layer or stack of layers which is provided with end contacts and arranged on a support of an electrically insulating material. In accordance with the invention, the dimension of the layer or stack of layers in at least one direction parallel to the surface of the support is smaller than the dimension of the support in the direction, while leaving portions of the surface of the support clear on at least two sides of the layer or stack of layers, and end contacts for the layer or stack of layers are situated on the surface portions of the support which are free of this layer or stack of layers, the thickness of the end contacts being larger than the thickness of the layer or stack of layers.