METHOD AND INSTRUMENT FOR THICKNESS MEASUREMENT AND WAFER
- 申请公布号：
- JP2002243416(A)
- 申请号：
- JP20010036195
- 申请日期：
- 2001.02.13
- 申请公布日期：
- 2002.08.28
- 申请人：
- TOCHIGI NIKON CORP;NIKON CORP
- 发明人：
- FUKAZAWA RYOICHI
- 分类号：
- G01B11/06;H01L21/66;(IPC1-7):G01B11/06
- 主分类号：
- G01B11/06
- 摘要：
- PROBLEM TO BE SOLVED: To prevent a body to be measured from being damaged and contaminated and so on by practically measuring the thickness of the object body without contacting. SOLUTION: The terahertz pulse light emitted by a teraheltz light generator 7 irradiates the body 20 to be measured. The teraheltz pulse light transmitted through the body 20 to be measured is detected by a teraheltz light detector 11. While a movable mirror 10 is shifted, the detector 11 is gated to measure the time-series waveform of the electric field intensity of the transmitted light from the body 20 to be measured. According to the measured time-series waveform, the thickness of the object body 20 is computed.
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