HEAT SINK ASSEMBLY RETAINER FOR ELECTRONIC INTEGRATED CIRCUIT PACKAGE

申请公布号：: US2002118513(A1)
申请号：: US20010795902
申请日期：: 2001.02.27
申请公布日期：: 2002.08.29
申请人：: KOSEKI YOSHITSUGU;YU HUNG-JI
发明人：: KOSEKI YOSHITSUGU;YU HUNG-JI
分类号：: H01L23/40;(IPC1-7):H05K7/20
主分类号：: H01L23/40
摘要：: A retainer device (1) for fastening a heat sink (2) to a printed circuit board module (3). The heat sink comprises a base plate (22) and a plurality of upwardly extending fins (24). The retainer device comprises an operation lever (14), a fastening frame (12), and a backing plate (16) attached to a bottom surface of the module. Clasp hooks (162) of the backing plate hold the fastening frame in place. The fastening frame has pairs of pivot openings (129), cam plates (128), and cutouts (130). The operation lever includes an operational body (142), a pair of arms (144), a pair of U-shaped urging portions (146), and a pair of pivot axles (148) passing through the pivot openings. The operational body is rotated to make the urging portions pass around the camplates into the cutouts. The heat sink is thereby pressed tightly against the printed circuit board module.