THROTTLE DEVICE AND ITS MANUFACTURING METHOD

申请公布号：

JP2002285866(A)

申请号：

JP20010090999

申请日期：

2001.03.27

申请公布日期：

2002.10.03

申请人：

DENSO CORP

发明人：

NAKANO YUJI;SANO AKIRA;YAGI KANICHI

分类号：

F02M35/10;F02D9/10;F02D41/00;(IPC1-7):F02D9/10

主分类号：

F02M35/10

摘要：

PROBLEM TO BE SOLVED: To reduce manufacturing man-hours of a throttle device 1 housing a circuit board 3 in a throttle body 2 and to secure a good heat radiation property of the circuit board 3. SOLUTION: In resin molding of the throttle body 2, the circuit board 3 equipped with a heat sink 10 via an insulating member 11 is formed in the throttle body 2 by insert molding so that a radiation face 10a in the heat sink 10 is exposed to the outside face of the throttle body 2, while a connector 2a for connecting the circuit board 3 to an external wire is formed by integral molding in a position matching a terminal 6 on the circuit board 3 inside the throttle body 2. In this way, complicated work required for a conventional throttle device assembling process, such as the installation of the circuit board 3 to the throttle body 2, attachment of a hermetic packing and installation of a cover, can be dispensed with, and assembly man-hours for the throttle device can be greatly reduced. In addition, the good heat radiation property of the circuit board 3 can be secured.