申请公布号：

KR100395673(B1)

申请号：

KR20010000107

申请日期：

2001.01.03

申请公布日期：

2003.08.25

分类号：

H01L21/50

主分类号：

H01L21/50

摘要：

PURPOSE: A method for fabricating a semiconductor assembly frame and an assembly thereof are provided to reduce a fabricating cost and increase productivity by omitting a silver-plating process on a heat-sink plate. CONSTITUTION: A lead frame(100) and a base frame(200) are aligned by using guide holes(160,230) formed on each edge of the lead frame(100) and the base frame(200). An upper end of a heat-sink plate(210) is adhered to a chip loading portion(120) and a lower end portion of a mold(150) by using an adhesive. A chip is adhered on a plating portion of the chip loading portion(120) after the adhesive is hardened. An inner lead line(135) is bonded to the chip by a wire. A semiconductor assembly is completed by adhering a cap to an upper end portion of the mold(150). A heat-sink plate(210) is formed on a bottom portion of the semiconductor assembly. The heat-sink plate(210) has a multitude of heat-sink through-hole(220). The chip loading portion(120) is formed thereon. A plurality of lead line(130) and a wire bonding chip are formed on the chip loading portion(120).