OUTER PACKAGE MEMBER FOR ELECTRONIC APPARATUS CONFIGURED IN UNITS OF MODULES EACH COMPRISING STACKED MULTIPLE MATERIALS AND ITS MANUFACTURING METHOD

申请公布号：: JP2004186394(A)
申请号：: JP20020351119
申请日期：: 2002.12.03
申请公布日期：: 2004.07.02
申请人：: PRO SAIDO KK
发明人：: SHIINA AKIYOSHI
分类号：: H05K5/02;(IPC1-7):H05K5/02
主分类号：: H05K5/02
摘要：: PROBLEM TO BE SOLVED: To provide an outer package member for enclosures of various electronic apparatuses wherein various kinds of diversified characteristics and designs are required whereby outer materials in matching with respective requirements of various apparatuses are quickly developed at a low cost. SOLUTION: Stacked members each comprising a plurality of materials with different characteristics and an area in a prescribed unit are layered, a plurality of the stacked members are fixed by an adhesion process or a thermo compression bonding process to configure a single module, and a plurality of the single modules are fixed by an adhesion process or a thermo compression bonding process to form the outer package member with a required area. COPYRIGHT: (C)2004,JPO&NCIPI