Support structure for thinning semiconductor substrates and thinning methods employing the support structure
- 申请公布号：
- US2005064681(A1)
- 申请号：
- US20030666742
- 申请日期：
- 2003.09.19
- 申请公布日期：
- 2005.03.24
- 发明人：
- WOOD ALAN G.;FARNWORTH WARREN M.;HEMBREE DAVID R.;RIGG SIDNEY B.;HIATT WILLIAM M.;BENSON PETER;KIRBY KYLE K.;AKRAM SALMAN
- 分类号：
- E21B43/02;G03F7/00;G03F7/004;H01L21/30;H01L21/46;(IPC1-7):H01L21/46
- 主分类号：
- E21B43/02
- 摘要：
- A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface. Assemblies that include the support structure and a semiconductor substrate are also within the scope of the present invention, as are methods for forming the support structures and thinning and post-thinning processes that include use of the support structures.
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