WIRING BOARD FOR LIGHT EMITTING ELEMENT

申请公布号：

WO2005106973(A1)

申请号：

WO2005JP06727

申请日期：

2005.03.30

申请公布日期：

2005.11.10

申请人：

KYOCERA CORPORATION;HASEGAWA, TOMOHIDE;IZUMI, MINAKO;SASAKI, YASUHIRO;HAMADA, NORIAKI;OKAMURA, TAKUJI;MOTOMURA, KOICHI

发明人：

HASEGAWA, TOMOHIDE;IZUMI, MINAKO;SASAKI, YASUHIRO;HAMADA, NORIAKI;OKAMURA, TAKUJI;MOTOMURA, KOICHI

分类号：

H01L33/48;H01L33/64;H05K1/02;H05K1/03;H05K3/40

主分类号：

H01L33/48

摘要：

A wiring board for light emitting element comprising a ceramic insulating substrate, and a conductor layer formed on the surface of the insulating substrate or in the insulating substrate, with an area for mounting a light emitting element on one side of the insulating substrate. The insulating substrate is provided with a thermally conductive columnar conductor having a thermal conductivity higher than that of the insulating substrate. The thermally conductive columnar conductor extends through the insulating substrate in the thickness direction thereof from the area for mounting a light emitting element and is formed through simultaneous burning with the insulating substrate. The wiring board can be produced inexpensively through simultaneous burning, and furthermore, it exhibits excellent heat dissipation properties. When a light emitting element is mounted, heat generated therefrom can be dissipated quickly to the outside and lowering in luminance of the light emitting element due to heat generation can be prevented effectively.