INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER
- 申请公布号：
- US2008042245(A1)
- 申请号：
- US20060465706
- 申请日期：
- 2006.08.18
- 申请公布日期：
- 2008.02.21
- 申请人：
- STATS CHIPPAC LTD.
- 发明人：
- LEE SANG-HO;HA JONG-WOO;PARK SOO-SAN
- 分类号：
- H01L23/12
- 主分类号：
- H01L23/12
- 摘要：
- An integrated circuit packaging system is provided including forming a first device wafer having a first backside and a first active side; forming a waferscale spacer wafer having a waferscale spacer and a first opening; mounting the waferscale spacer wafer on the first backside; and singulating an first integrated circuit die having the waferscale spacer from the first device wafer having the first backside with the waferscale spacer wafer thereon.
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