CONVEYANCE DEVICE AND CONVEYANCE METHOD

申请公布号：

KR20080102361(A)

申请号：

KR20087018141

申请日期：

2008.07.23

申请公布日期：

2008.11.25

申请人：

LINTEC CORPORATION

发明人：

NONAKA HIDEAKI;NAKATA KAN

分类号：

H01L21/677;B25J13/00

主分类号：

H01L21/677

摘要：

<p>A conveyance device (10) constructed from a multijoint robot having first to sixth arms (15A-15F) that are each numerically controlled. A suction arm (12) for sucking and holding a semiconductor wafer (W) is provided on the free end side of the conveyance device (10). The suction arm (12) has a suction section (12C) on the forward end side of the arm and is mounted so as to be movable in three perpendicular axes (X, Y, Z axes) through the arms (15A-15F) and so as to be rotatable in the direction tilting relative to an imaginary plane (S). Accordingly, even if the semiconductor wafer (W) is tilted relative to the imaginary plane (S), the suction section (12C) can be brought to intimate contact with the wafer (W) by changing the angle of the suction arm (12).</p>