MULTILAYER CERAMIC ELECTRONIC COMPONENT AND ITS MANUFACTURING PROCESS

申请公布号：: JP2008198655(A)
申请号：: JP20070029459
申请日期：: 2007.02.08
申请公布日期：: 2008.08.28
申请人：: AIOMU TECHNOLOGY:KK
发明人：: SAKAI TOKUYUKI;NOHARA TAKATSUGU
分类号：: H01G4/12;H01B1/00;H01B1/22;H01G4/30
主分类号：: H01G4/12
摘要：: PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component in which an internal conductor layer can be formed continuously without taking a manufacturing process having a high risk of quality even when the number of layers is increased by thinning a ceramic layer, and deformation at the lead-out portion of the internal conductor layer or the occurrence of cracking or delamination can be suppressed by reducing the level difference due to the thickness of the internal conductor layer. SOLUTION: Thickness of the internal conductor layer after printing and firing can be made thin by employing conductive paste where 30 wt.% or more of metal powder contained in conductive paste used as an internal conductor is phosphorus flake powder. Since level difference due to the thickness of the internal conductor is reduced, deformation at the lead-out portion of the internal conductor of a multilayer ceramic electronic component is prevented and a multilayer ceramic electronic component free from cracking or delamination can be obtained easily. COPYRIGHT: (C)2008,JPO&INPIT