LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 申请公布号：
- KR20100058769(A)
- 申请号：
- KR20080117298
- 申请日期：
- 2008.11.25
- 申请公布日期：
- 2010.06.04
- 申请人：
- SAMSUNG LED CO., LTD.
- 发明人：
- JOO, SEONG AH;PARK, NA NA;PARK, LL WOO
- 分类号：
- H01L33/56
- 主分类号：
- H01L33/56
- 摘要：
- PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to overcome limitation of appearance and design of the light emitting diode package by forming a thin film on the top of the package mold and covering the original color of fluorescent substance. CONSTITUTION: A pair of lead frames(110) is prepared. A package mold(120) comprises a molding material filling space. An LED chip(130) is mounted on the lead frame inside the package mold. A thin film(160) opens and shuts the molding material fill space of the package mold. A molding material(150) is filled in the molding material filling space of the package mold.
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