ELECTROCONDUCTIVE FILM PATTERN AND METHOD FOR FORMING AN ELECTROCONDUCTIVE FILM PATTERN
- 申请公布号：
- WO2010134536(A1)
- 申请号：
- WO2010JP58415
- 申请日期：
- 2010.05.19
- 申请公布日期：
- 2010.11.25
- 申请人：
- KONICA MINOLTA HOLDINGS, INC.;YANATA ATSURO
- 发明人：
- YANATA ATSURO
- 分类号：
- H01B5/14;H01B13/00;H05K3/10;H05K3/38
- 主分类号：
- H01B5/14
- 摘要：
- <p>Disclosed are an electroconductive film pattern and a method for forming the same, in which an electroconductive film pattern having superior variations in film thickness and surface planarity, and satisfactory adhesion to a substrate is formed without the need for complex and expensive equipment and processes. The electroconductive film pattern is formed by placing ink containing fine metallic particles on a substrate and carrying out sintering, and the ink exhibits positive (or negative) zeta potential. A primer layer having a negative (or positive) charge is formed on the surface of the substrate where the ink is placed.</p>
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