MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME
- 申请公布号：
- US2011042824(A1)
- 申请号：
- US20100857893
- 申请日期：
- 2010.08.17
- 申请公布日期：
- 2011.02.24
- 申请人：
- FUJITSU LIMITED
- 发明人：
- KOIDE MASATERU
- 分类号：
- H01L23/538;H01L21/60
- 主分类号：
- H01L23/538
- 摘要：
- A multi-chip module includes a package board, a plurality of chips, and a wiring board. The plurality of chips are horizontally disposed on the package board. The plurality of chips are electrically connected with the package board, and respectively provided with via holes which penetrate through the plurality of chips. The plurality of chips are respectively provided with circuits at surfaces facing the package board. The wiring board is disposed on an opposite side to the package board across the plurality of chips. The wiring board includes a wiring pattern which is electrically connecting adjacent chips one another. The circuit is electrically connected to the wiring pattern through the via holes.
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