SUBSTRATE TREATMENT APPARATUS
- 申请公布号:
- JP2011077064(A)
- 申请号:
- JP20090223665
- 申请日期:
- 2009.09.29
- 申请公布日期:
- 2011.04.14
- 申请人:
- DAINIPPON SCREEN MFG CO LTD
- 发明人:
- YAMASHITA EIJI;JODAI KAZUO
- 分类号:
- H01L21/306
- 主分类号:
- H01L21/306
- 摘要:
- PROBLEM TO BE SOLVED: To reduce the frequency of exchange of an etching liquid in a substrate treatment apparatus for applying etching treatment to a substrate. SOLUTION: The substrate treatment apparatus 1 for applying etching treatment to a substrate 9 having a silver thin film formed on a glass substrate includes a treatment chamber 11 for reserving the etching liquid, a substrate supporting section 12 for supporting the substrate 9 arranged in parallel in the treatment chamber 11, and an absorbent cartridge 13 opposing a top surface 91 of the substrate 9 in the treatment chamber 11. The absorbent cartridge 13 has a sheet-like absorbent 131 and is immersed in the etching liquid together with the substrate 9 so that a silver ion generated by the etching treatment for the top surface 91 of the substrate 9 can be absorbed by the absorbent 131. Thus, an increase in density of metal ions in the etching liquid is suppressed, a metal ion in the etching liquid is prevented from being reduced and precipitated to the substrate 9, and a frequency of exchange of the relatively expensive etching liquid is reduced. COPYRIGHT: (C)2011,JPO&INPIT
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