COPPER ALLOY SHEET, METHOD FOR PRODUCTION OF COPPER ALLOY SHEET, AND ELECTRIC/ELECTRONIC COMPONENT
- 申请公布号：
- JP2011231393(A)
- 申请号：
- JP20100123756
- 申请日期：
- 2010.05.31
- 申请公布日期：
- 2011.11.17
- 申请人：
- DOWA METALTECH KK
- 发明人：
- KO IRIN;SUGAWARA AKIRA;MIYAHARA YOSHISUKE;SUDA HISASHI
- 分类号：
- C22C9/06;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/05;C22C9/10;C22F1/00;C22F1/08;H01B1/02;H01B5/02;H01B13/00
- 主分类号：
- C22C9/06
- 摘要：
- <P>PROBLEM TO BE SOLVED: To provide a copper alloy sheet having conductivity of 30% IACS or more, 0.2% stress proof of 900 MPa or more and having both of excellent bending workability and stress relaxation property, and to provide a method for production thereof. <P>SOLUTION: The copper alloy sheet contains, by mass, 1.0-3.5% Ni, 0.5-2.0% Co, 0.3-1.5% Si, and the balance Cu with inevitable impurities, wherein the mass ratio of Co/Ni is 0.15-1.5, and the mass ratio of (Ni+Co)/Si is 4-7. In observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, the density of twin boundaries among all crystal grain boundaries is 40% or more, and the area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface. <P>COPYRIGHT: (C)2012,JPO&INPIT
Copyright Notice © 2009-2024 传众 版权所有