Plasma mediated processing of non-conductive substrates
- 申请公布号：
- US8318265(B2)
- 申请号：
- US20080137816
- 申请日期：
- 2008.06.12
- 申请公布日期：
- 2012.11.27
- 申请人：
- SCHERER BRIAN JOSEPH;ERLAT AHMET GUN;YAN MIN;GENERAL ELECTRIC COMPANY
- 发明人：
- SCHERER BRIAN JOSEPH;ERLAT AHMET GUN;YAN MIN
- 分类号：
- H05H1/24
- 主分类号：
- H05H1/24
- 摘要：
- Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.
Copyright Notice © 2009-2024 传众 版权所有