LED-PACKAGE MANUFACTURING SYSTEM

申请公布号：

KR20130095173(A)

申请号：

KR20127022199

申请日期：

2011.05.09

申请公布日期：

2013.08.27

申请人：

PANASONIC CORPORATION

发明人：

NONOMURA MASARU

分类号：

H01L33/50;H01L33/00;H01L33/48

主分类号：

H01L33/50

摘要：

<p>There are prepared element characteristic information 12 obtained by previously, individually measuring light emission characteristics of a plurality of LED elements and resin coating information 14 that correlates an appropriate amount of resin to be applied for acquiring an LED package exhibiting a specified light emission characteristic and the element characteristic information 12. A map preparation processing section 74 prepares, for each board, map data 18 correlating mounting position information 71a showing position of the LED element mounted on the board by a component mounting device M1 and the element characteristic information 12. There is updated the resin coating information 14 on the basis of an inspection result fed back to a resin coating device M4 as a result of a completed product coated with a resin being inspected by a light emission characteristic inspection device M7.</p>