Method of manufacturing an electrically conductive or semiconductive structure and electronic device comprising the same
- 申请公布号：
- GB201319263(D0)
- 申请号：
- GB20130019263
- 申请日期：
- 2013.10.31
- 申请公布日期：
- 2013.12.18
- 申请人：
- MONTANUNIVERSIT?T LEOBEN
- 摘要：
- The present invention relates to a method of manufacturing an electrically conductive or semiconductive structure on a substrate, electronic devices comprising a substrate and an electrically conductive or semiconductive structure, and uses thereof. The method of manufacturing an electrically conductive or semiconductive structure on a substrate comprises the steps of: applying electrically conductive or semiconductive particles on the substrate; applying at least one cross- linking compound having energetically activatable groups on the substrate; irradiating at least a part of the energetically activatable groups with an energy-carrying activation beam to thereby trigger at least a partial cross-linking of the at least one cross-linking compound so as to obtain an irradiated structure comprising at least partially cross- linked electrically conductive or semiconductive particles; supplying thermal energy for rearranging at least a part of the at least partially cross-linked electrically conductive or semiconductive particles to form a connected electrically conductive or semiconductive structure and for removing at least a part of the cross-linked compound from the substrate.
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