TRANSFER JIG AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT USING THE SAME
- 申请公布号：
- JP2015012214(A)
- 申请号：
- JP20130137831
- 申请日期：
- 2013.07.01
- 申请公布日期：
- 2015.01.19
- 申请人：
- MURATA MFG CO LTD
- 发明人：
- SANO MASAHARU;SHIMIZU KOTARO
- 分类号：
- H01G13/00
- 主分类号：
- H01G13/00
- 摘要：
- <p>PROBLEM TO BE SOLVED: To provide a transfer jig capable of surely aligning a chip and being easily handled without incurring positional dislocation, and an efficient manufacturing method of an electronic component using the same.SOLUTION: A through hole 11 formed on an insertion pallet 10 is formed larger than a WT surface 1a of a chip 1 and smaller than an LW surface and an LT surface in such a shape that the chip can be passed therethrough only in an attitude with the WT surface down. A hold pallet 20 is formed in such a manner that (a) a depth D of a chip accommodation recess 21 is smaller than a length L of the chip, (b) the depth D of the chip accommodation recess is greater than a value resulting from subtracting a thickness Tp of the insertion pallet from the length L of the chip and greater than the thickness Tp of the insertion pallet, (c) a dimension resulting from adding the depth D of the chip accommodation recess and the thickness Tp of the insertion pallet is greater than the length L of the chip, and (d) a plane area of the chip accommodation recess is greater than a plane area of the through hole of the insertion pallet.</p>
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