SEMICONDUCTOR ADHESIVE

申请公布号：

WO2015025867(A1)

申请号：

WO2014JP71723

申请日期：

2014.08.20

申请公布日期：

2015.02.26

申请人：

SEKISUI CHEMICAL CO., LTD.

发明人：

NAGATA MAI;TAKEDA KOHEI;OKAYAMA HISATOSHI;HATAI MUNEHIRO

分类号：

H01L21/60;C09J11/06;C09J163/00

主分类号：

H01L21/60

摘要：

The objective of the present invention is to provide a semiconductor adhesive capable of minimizing voids. The present invention is a semiconductor adhesive used in a method for manufacturing a semiconductor device having: a step (1) for aligning on a substrate a semiconductor chip in which a protruding electrode having a tip section comprising solder is formed in a peripheral portion and farther inward of the peripheral portion in the plane of the semiconductor chip, with the semiconductor adhesive being interposed therebetween; a step (2) for heating the semiconductor chip to a temperature at or above the melting point of the solder to fusion-bond the protruding electrode of the semiconductor chip and an electrode section of the substrate, and to temporarily bond the semiconductor adhesive; and a step (3) for heating the semiconductor adhesive in a pressurized environment to eliminate voids, wherein the semiconductor adhesive has a minimum melt viscosity of 1000 Pa・s or less at 80-200°C, and the time required to reach a reaction rate of 40% at 260°C is 8 seconds or more as determined using the Ozawa method.