ELEMENT-SEALING RESIN COMPOSITION FOR ORGANIC ELECTRONIC DEVICES, ELEMENT-SEALING RESIN SHEET FOR ORGANIC ELECTRONIC DEVICES, ORGANIC ELECTROLUMINESCENT ELEMENT, AND IMAGE DISPLAY

申请公布号：: JP2015191799(A)
申请号：: JP20140068582
申请日期：: 2014.03.28
申请公布日期：: 2015.11.02
申请人：: FURUKAWA ELECTRIC CO LTD:THE
发明人：: ISHIZAKA YASUSHI;NAKAMURA TOSHIMITSU;ASANUMA TAKUMI
分类号：: H05B33/04;H01L51/50
主分类号：: H05B33/04
摘要：: PROBLEM TO BE SOLVED: To provide: a resin composition for sealing an organic electroluminescent element, which is arranged focusing on a moisture-absorbing filler and enables the enhancement of a gas-barrier performance by optimizing the blend ratio of a moisture-absorbing filler; an element-sealing resin sheet for organic electronic devices; an element for organic electronic devices, which is sealed by an element-sealing resin composition for organic electronic devices; and an image display.SOLUTION: An element-sealing resin composition for organic electronic devices according to the present invention is one for sealing an element for organic electronic devices. The element-sealing resin composition comprises: a polyisobutylene-based resin (A) including a polyisobutylene skeleton in its main chain or side chain and having a weight-average molecular weight of 300000 or larger; and a moisture-absorbing filler (B) of which the content is 10-60 wt.% to the total weight thereof.