ACCURATE FILM THICKNESS CONTROL IN GAP-FILL TECHNOLOGY
- 申请公布号：
- KR20150126773(A)
- 申请号：
- KR20150052371
- 申请日期：
- 2015.04.14
- 申请公布日期：
- 2015.11.13
- 申请人：
- APPLIED MATERIALS, INC.
- 发明人：
- LI NING;YAN WENBO;NGUYEN VICTOR;TRINH CONG;BALSEANU MIHAELA;XIA LI QUN
- 分类号：
- H01L21/314;H01L21/306;H01L21/66;H01L21/768
- 主分类号：
- H01L21/314
- 摘要：
- Embodiments disclosed in the present invention generally relate to processing of substrates, and more particularly, relate to methods for accurate control of film thickness using deposition-etch cycles. Particularly, embodiments of the present invention may be used in controlling film thickness during filling high aspect ratio features.
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