THERMOSETTING RESIN CURING METHOD AND THERMOSETTING RESIN CURING APPARATUS
- 申请公布号：
- JP2016041518(A)
- 申请号：
- JP20150247615
- 申请日期：
- 2015.12.18
- 申请公布日期：
- 2016.03.31
- 申请人：
- HAMAMATSU PHOTONICS KK
- 发明人：
- OMIYA TAKENORI;OISHI SATOSHI
- 分类号：
- B29C35/08;B29C65/48
- 主分类号：
- B29C35/08
- 摘要：
- PROBLEM TO BE SOLVED: To provide a thermosetting resin curing method and a thermosetting resin curing apparatus capable of satisfactorily curing a thermosetting resin agent by irradiation with a laser beam.SOLUTION: The thermosetting resin curing method cures a thermosetting resin agent 13 by irradiation with a laser beam L. The laser beam L has a wavelength longer than a wavelength region in which the light absorptivity of the thermosetting resin agent 13 is maximum or a wavelength shorter than the wavelength region and is irradiated on the thermosetting resin agent 13. The intensity of the laser beam L irradiated on the thermosetting resin agent 13 is changed from a first light intensity to a second light intensity lower than the first light intensity.SELECTED DRAWING: Figure 6
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