MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

申请公布号：

WO2016048384(A1)

申请号：

WO2014US57922

申请日期：

2014.09.27

申请公布日期：

2016.03.31

申请人：

INTEL CORPORATION

发明人：

SMALLEY, JEFFORY, L.;SMITH, SUSAN, F.;PRAKASH, MANI;LIU, TAO;BOSAK, HENRY, C.;KOFSTAD, HARVEY, R.;ORTIZ, ALMANZO, T.

分类号：

H01L23/34

主分类号：

H01L23/34

摘要：

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.