PASTE OF HEAT-RESISTANT RESIN

申请公布号：

JPH10330616(A)

申请号：

JP19970142252

申请日期：

1997.05.30

申请公布日期：

1998.12.15

申请人：

HITACHI CHEM CO LTD

发明人：

SAKATA TOICHI;NISHIZAWA HIROSHI;HIRAI KEIZO;SUZUKI KENJI

分类号：

C08J3/24;C08L79/08;C09J9/00;C09J179/08;H01L21/52;H01L23/29;H01L23/31;H01L23/495;(IPC1-7):C08L79/08

主分类号：

C08J3/24

摘要：

<p>PROBLEM TO BE SOLVED: To obtain the subject paste capable of fast bonding a semiconductor chip to a lead frame by including a specific heat-resistant resin, fine organic particles, specific crosslinking agent and solvent in such a way to secure specific phase conditions before and after drying under heating. SOLUTION: This paste comprises (A) a heat-resistant resin preferably losing its weight by 1% under heating at 350 deg.C or higher, and having hydroxyl, amino or carboxyl group in the molecule, (B) fine organic particles, preferably of heat-resistant resin having an average particle size of 20μm or less, and losing its weight by 1% under heating at 350 deg.C or higher, (C) a crosslinking agent, preferably a coupling agent having a functional group capable of chemically bonding to hydroxyl, amino or carboxyl group, and (D) a solvent, in such a composition that the components A, C and D form a homogeneous phase in which the component B is present as a heterogeneous phase before drying under heating, and a homogeneous phase containing the components A, B and C is formed after drying under heating.</p>