SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- 申请公布号:
- KR20070117991(A)
- 申请号:
- KR20067019136
- 申请日期:
- 2006.09.18
- 申请公布日期:
- 2007.12.13
- 申请人:
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 发明人:
- KOMATSU SHINGO;NAKATANI SEIICHI;HIRANO KOICHI
- 分类号:
- H01L23/48;H01L21/60
- 主分类号:
- H01L23/48
- 摘要:
- Disclosed is a semiconductor device wherein a semiconductor chip (501) is mounted on the surface of an electrically insulating substrate (504) having a plurality of metal wires (505) and at least a part of the metal wires (505) are covered with a resin (509). Among the metal wires (505) formed in the electrically insulating substrate (504), at least the surfaces of the metal wires electrically connected with the semiconductor chip (501) are provided with a gold layer (508), and the surfaces of the metal wires in contact with the resin (509) are provided with a roughened portion (507) without being provided with a gold layer. Consequently, the semiconductor device mounted with a semiconductor chip is improved in reliability of electrical connection. Also disclosed is a method for manufacturing such a semiconductor device.
Copyright Notice © 2009-2024 传众 版权所有