Semiconductor device

申请公布号：

US7485972(B2)

申请号：

US20060356144

申请日期：

2006.02.17

申请公布日期：

2009.02.03

申请人：

PANASONIC CORPORATION

发明人：

IKUTA TERUHISA;OGURA HIROYOSHI;SATO YOSHINOBU;TERASHITA TORU;ICHIJO HISAO

分类号：

H01L23/12

主分类号：

H01L23/12

摘要：

Provided is a semiconductor device which includes a conductive bonding pad formed on a semiconductor substrate of the first conduction type via an insulating film and a diffusion layer of the second conduction type formed on a surface of the semiconductor substrate under the bonding pad. Characteristics do not deteriorate even when a breakdown occurs during wire bonding.