Method for removing surface layers

申请公布号：

DE3834396(A1)

申请号：

DE19883834396

申请日期：

1988.10.10

申请公布日期：

1990.04.12

申请人：

TELEFUNKEN ELECTRONIC GMBH, 7100 HEILBRONN, DE

发明人：

EBERT, THOMAS, DIPL.-ING. (FH), 7092 ROSENBERG, DE

分类号：

H01L21/306

主分类号：

H01L21/306

摘要：

The invention relates to a method for removing surface layers on semiconductor wafers, especially layers of wax or film (foil), wherein the surface layer is removed using a solvent. The invention provides for the method to include a precleaning step, a fine cleaning step, an intermediate cleaning step, a rinsing step and a drying step, and for the solvent to consist of xylol both for the precleaning step and for the fine cleaning step.